Inductively Coupled Plasma Etching of Bulk Titanium for MEMS Applications
نویسندگان
چکیده
Titanium is a promising new material system for the bulk micromachining of microelectromechanical MEMS devices. Titaniumbased MEMS have the potential to be used for a number of applications, including those which require high fracture toughness or biocompatibility. The bulk titanium etch rate, TiO2 mask etch rate, and surface roughness in an inductively coupled plasma ICP as a function of various process parameters are presented. Optimized conditions are then used to develop the titanium ICP deep etch TIDE process. The TIDE process is capable of producing high aspect ratio structures with smooth sidewalls at etch rates in excess of 2 m/min, providing a new means for the microfabrication of titanium-based MEMS devices. © 2005 The Electrochemical Society. DOI: 10.1149/1.2006647 All rights reserved.
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